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HUF76013P3 数据表(PDF) 11 Page - Intersil Corporation |
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HUF76013P3 数据表(HTML) 11 Page - Intersil Corporation |
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11 / 11 page ![]() 11 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with- out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 HUF76013P3, HUF76013D3S TO-220AB 3 LEAD JEDEC TO-220AB PLASTIC PACKAGE E ØP Q D H1 E1 L L1 60o b1 b 1 2 3 e e1 A c J1 45o D1 A1 TERM. 4 SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A 0.170 0.180 4.32 4.57 - A1 0.048 0.052 1.22 1.32 - b 0.030 0.034 0.77 0.86 3, 4 b1 0.045 0.055 1.15 1.39 2, 3 c 0.014 0.019 0.36 0.48 2, 3, 4 D 0.590 0.610 14.99 15.49 - D1 - 0.160 - 4.06 - E 0.395 0.410 10.04 10.41 - E1 - 0.030 - 0.76 - e 0.100 TYP 2.54 TYP 5 e1 0.200 BSC 5.08 BSC 5 H1 0.235 0.255 5.97 6.47 - J1 0.100 0.110 2.54 2.79 6 L 0.530 0.550 13.47 13.97 - L1 0.130 0.150 3.31 3.81 2 ØP 0.149 0.153 3.79 3.88 - Q 0.102 0.112 2.60 2.84 - NOTES: 1. These dimensions are within allowable dimensions of Rev. J of JEDEC TO-220AB outline dated 3-24-87. 2. Lead dimension and finish uncontrolled in L1. 3. Lead dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder coating. 5. Position of lead to be measured 0.250 inches (6.35mm) from bot- tom of dimension D. 6. Position of lead to be measured 0.100 inches (2.54mm) from bot- tom of dimension D. 7. Controlling dimension: Inch. 8. Revision 2 dated 7-97. |
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