AN1235

Conclusion

Doc ID 7272 Rev 8

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Conclusion

Lead-free Flip-Chip packages have been developed by STMicroelectronics for electronic

applications where integration and performance are the main concerns of designers.

STMicroelectronics Flip Chips offer:

●

Remarkable board space saving (package size equal to die size and total height less

than 715 µm)

●

Enhanced electrical performance (minimized parasitic inductance due to very short

electrical paths and absence of redistribution layer)

●

High reliability due to integration of a whole function traditionally based on discrete

interconnected components.

Flip Chips are delivered in tape and reel and are fully compatible with other high volume

SMD components (standard plastic packages or CSP/BGA packages) regarding existing

pick and place equipment, standard solder reflow assembly equipment and standard PCB

techniques.

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Revision history

Table 5.

Document revision history

Date

Revision

Changes

June-2002

1

First issue

January-2004

2

Lead free information added

25-May-2004

3

Mechanical description notes updated on page 2

15-Sep-2006

4

Reformatted to current standard.

15-Oct-2006

5

Added section 5.4.1 on Rework procedure.

09-Mar-2010

6

Updated bump composition in Section 1: Product description and

Section 2: Mechanical description. Updated solder paste

composition in Section 5.2: PCB assembly guidelines.

06-Sep-2011

7

Updated references to standards. Added Figure 6. Updated reel

label in Figure 8. Updated soldering reflow profile in Figure 9.

19-Oct-2012

8

Corrected typographical error in Figure 9. Restructured Table 4