Packing specifications and labeling description

AN1235

4/14

Doc ID 7272 Rev 8

Figure 4.

Tape dimensions for Flip Chips (650 µm thickness)

The cavities in the carrier tape have been designed to avoid any damage to the

components. No hole is present in the cavity to avoid any impact or any external

contamination to the solder bumps.

The embossed carrier tape is in a black conductive material (surface resistivity within

10E4 and 10E8 ohm/sq). Use of this material protects the component against damage from

electrostatic discharge and ensures the total discharge of the component prior to placement

on the PCB. Conductivity is guaranteed to be constant and not affected by shelf life or

humidity. The material will not break when bent and does not have any residue to rub off,

powder, or flake.

3.2

Cover tape

The carrier tape is sealed with a transparent, antistatic (surface resistivity within

10E5 ohm/sq and 10E11 ohm/sq) polyester film cover tape with a heat activated adhesive.

The cover tape tensile strength is higher than 10 N.

The peeling force of the cover tape is between 0.08 N and 0.5 N in accordance with the

testing method EIA-481-D and IEC 60286-3. Cover tape is peeled back in the direction

opposite to the carrier tape travel; the angle between the cover tape and the carrier tape is

between 165 and 180 degrees and the test is done at a speed of 120 ± 10% mm/minute.

Table 1.

Tape cavity sizing

Dimension

Die with both sides

smaller than or equal to 1.5 mm

Die with one side larger than 1.5 mm

A0 and B0

Die side size + 70 µm

Cavity dimensions established to ensure that

component rotation cannot exceed 5° max.

Dot identifying bump A1 location

A1 bump location may vary with product layout

User direction of unreeling

Typical dimensions in mm

4.0

4.0

2.0

Ø 1.55

0.73

1.24

0.20