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AN3387 数据表(PDF) 5 Page - STMicroelectronics |
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AN3387 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() AN3387 PM8803 layout guideline Doc ID 018735 Rev 1 5/12 1.3 How to layout the PM8803 different ground pins There are 4 different ground pins on the PM8803: VSS, RTN1, RTN2, and ARTN, plus the exposed pad. The exposed pad of the PM8803 must be connected to VSS: design a fill area with at least 6 vias to VSS plane. Try, where possible, to increase the number of VSS power planes connected, at least below the PM8803 position, to improve the heat dissipation of the PM8803. RTN1 and RTN2 are power ground pins for GAT1 and GAT2 drivers respectively. These pins are not internally connected together and therefore must be externally connected with a wide, short connection at the same point of the board power ground, which, in the following is called GND. Use a wide power copper plane for such connections; avoid to use traces as much as possible. Board GND must be divided into power GND (to connect input caps, Rsense, PM8803 pin 4 and 9, SA auxiliary circuitry, isolation cap) and signal GND or ARTN (to connect the other components around the PM8803, the circuitry powered by VC voltage, and the IC pin 8). The signal GND must be connected to power GND in one point only, close to the PM8803 RTN pins 4 and 9. Use large copper plane for the power GND, if possible foresee a layer completely dedicated to this. ARTN can be a small copper plane or a wide trace connecting the several components referred to it. On the secondary side keep separated the power path of the power secondary GND (output side of transformer, secondary rectifier, output capacitors) from the feedback network GND, which is connected only at the output capacitors side. VSS is the low potential of PoE voltage; it can be routed with a wide trace, but close to the PM8803 as it must become a copper plane, in order to dissipate the heat transferred through the exposed pad of PM8803. |
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