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AN4209 数据表(PDF) 9 Page - STMicroelectronics

部件名 AN4209
功能描述  Design methodology for repetitive voltage suppressors
PDF  19 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

AN4209 数据表(HTML) 9 Page - STMicroelectronics

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9/19
AN4209
STRVS parameters
Figure 6. Thermal impedance variation of SMB package versus the pulse duration
When the STRVS works under repetitive mode operation, the peak junction temperature
Tjpeak must be below absolute rating Tjmax specified in the datasheet.
For an infinite pulse train case, Tjpeak is expressed as shown in Equation 10:
Equation 10
Note:
The background average power PD has been subtracted, to avoid counting this effect twice
in calculating temperature rise.
In power conversion applications, two main cases occur. The time constants of the transient
thermal impedance
thermal must be considered regarding the switching period tSW in the
application. Figure 7 illustrates the impact of operating frequency on the ripple temperature.
The time constant of a thermal system is dependent on its transient thermal impedance
curve. A sufficient estimation of thermal constant can be easily made from the simple RC
thermal model representing the Zth(j-Ref) curve.
Equation 11
Equation 12
Equation 12 applied to Figure 6 for an application working switching period tsw, around
10 µs, gives tau much greater than tsw due to the low value of Zth(@ 10 µs) before the Rth
value. In this case the junction temperature rises and falls with a negligible dynamic
temperature
T
j near Tjavg as shown in Figure 7.
Since Tjpeak  Tjavg, only the average junction temperature evaluation is needed using
Equation 6. Notice that this case represents 90% of switch mode power supply applications
(FSW > 20 kHz). Under these conditions, pulse widths are generally in the range of some
tens to hundreds of nanoseconds and pulses may be viewed as a short block of constant
power PSTEP, sustaining the junction temperature.
0.001
0.01
0.1
1
10
100
1000
0.000001 0.00001 0.0001
0.001
0.01
0.1
1
10
100
1000
10000
°C/W
tp(s)
ZTH(j-a)
ZTH(j-l)
Recommended pad layout
Printed circuit board FR4,
copper thickness = 35 µm
l
p
l
j
TH
D
Step
l
j
TH
D
p
peak
j
T
t
Z
P
P
R
P
t
T+
·
-
+
·
=
-
-
)
(
)
(
)
(
)
(
)
(
Zth(j-Ref)(t) = Rth(j-Ref) · (1 - e
(-t/tau))
tau = -t(ln(1-Zth(t)/Rth)



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