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RFHA1101 数据表(PDF) 2 Page - RF Micro Devices

部件名 RFHA1101
功能描述  Advanced GaN HEMT Technology
PDF  8 Pages
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制造商  RFMD [RF Micro Devices]
网页  http://www.rfmd.com
标志 RFMD - RF Micro Devices

RFHA1101 数据表(HTML) 2 Page - RF Micro Devices

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RF Micro Devices Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421
DS131023
For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
2 of 8
RFHA1101
Absolute Maximum Ratings
Parameter
Rating
Unit
Drain Voltage (VD)
155
V
Gate Voltage (VG)
-6 to +2
V
Gate Current (IG)
2.2
mA
Operational Voltage
28
V
Storage Temperature Range
-55 to +100
°C
Operating Junction Temperature (TJ)
200
°C
MTTF (TJ < 200°C, 95% Confidence Limits)*
1.8 x 10
7
Hours
Thermal Resistance, RTH (Junction to case)**
measured at TC = 85°C, DC bias only.
12.5
°C/W
Caution! ESD sensitive device.
RFMD Green: RoHS compliant per EU
Directive 2011/65/EU, halogen free per
IEC 61249-2-21, <1000ppm each of
antimony trioxide in polymeric materials
and red phosphorus as a flame retardant,
and <2% antimony solder.
Exceeding any one or a combination of the Absolute
Maximum Rating conditions may cause permanent
damage to the device. Extended application of Absolute
Maximum Rating conditions to the device may reduce
device reliability. Specified typical performance or
functional operation of the device under Absolute
Maximum Rating conditions is not implied.
..
Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device voltage and current
must not exceed the maximum operating values specified in the table above.
**User will need to define this specification in the final application and ensure bias conditions satisfy the following expression:
PDISS < (TJ - TC) / RTH J-C and TC = TCASE to maintain maximum operating junction temperature and MTTF.
Nominal Operating Parameters
Parameter
Specification
Unit
Condition
Min
Typ
Max
Recommended Operating
Conditions
Drain Voltage (VDSQ)
28
V
Gate Voltage (VGSQ)
-0.96
V
VD = 28V, ID = 44mA
Drain Bias Current
44
mA
Frequency of Operation
DC
10
GHz
Based on 10dB power gain, calculated from fMAX
DC Functional Test
VG (on) - Forward Bias Diode Gate
Voltage
0.4
0.95
1.2
V
IG = 2.22mA, VD = 0V
BV (off) - Drain Breakdown Voltage
100
>150
V
VG = -4V, ID = 2.22mA
VPO - Threshold Voltage
-1.9
-1.48
-1.1
V
VD = 20V, ID = 2mA
Die Capacitance from on-wafer CV measurements
CRSS
60
fF
VD = 28V, ID = 44mA
CISS
5460
fF
VD = 28V, ID = 44mA
COSS
895
fF
VD = 28V, ID = 44mA
* MTTF - median time to failure for wear-out failure mode (30% IDSS degradation) which is determined
by the technology process reliability. Refer to product qualification report for FIT (random) failure rate.



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