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RFHA1101 数据表(PDF) 2 Page - RF Micro Devices |
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RFHA1101 数据表(HTML) 2 Page - RF Micro Devices |
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2 / 8 page ![]() RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 DS131023 For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com. The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 2 of 8 RFHA1101 Absolute Maximum Ratings Parameter Rating Unit Drain Voltage (VD) 155 V Gate Voltage (VG) -6 to +2 V Gate Current (IG) 2.2 mA Operational Voltage 28 V Storage Temperature Range -55 to +100 °C Operating Junction Temperature (TJ) 200 °C MTTF (TJ < 200°C, 95% Confidence Limits)* 1.8 x 10 7 Hours Thermal Resistance, RTH (Junction to case)** measured at TC = 85°C, DC bias only. 12.5 °C/W Caution! ESD sensitive device. RFMD Green: RoHS compliant per EU Directive 2011/65/EU, halogen free per IEC 61249-2-21, <1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony solder. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. .. Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device voltage and current must not exceed the maximum operating values specified in the table above. **User will need to define this specification in the final application and ensure bias conditions satisfy the following expression: PDISS < (TJ - TC) / RTH J-C and TC = TCASE to maintain maximum operating junction temperature and MTTF. Nominal Operating Parameters Parameter Specification Unit Condition Min Typ Max Recommended Operating Conditions Drain Voltage (VDSQ) 28 V Gate Voltage (VGSQ) -0.96 V VD = 28V, ID = 44mA Drain Bias Current 44 mA Frequency of Operation DC 10 GHz Based on 10dB power gain, calculated from fMAX DC Functional Test VG (on) - Forward Bias Diode Gate Voltage 0.4 0.95 1.2 V IG = 2.22mA, VD = 0V BV (off) - Drain Breakdown Voltage 100 >150 V VG = -4V, ID = 2.22mA VPO - Threshold Voltage -1.9 -1.48 -1.1 V VD = 20V, ID = 2mA Die Capacitance from on-wafer CV measurements CRSS 60 fF VD = 28V, ID = 44mA CISS 5460 fF VD = 28V, ID = 44mA COSS 895 fF VD = 28V, ID = 44mA * MTTF - median time to failure for wear-out failure mode (30% IDSS degradation) which is determined by the technology process reliability. Refer to product qualification report for FIT (random) failure rate. |
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