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HI-8428-R 数据表(PDF) 16 Page - Holt Integrated Circuits |
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HI-8428-R 数据表(HTML) 16 Page - Holt Integrated Circuits |
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16 / 16 page ![]() PACKAGE DIMENSIONS HOLT INTEGRATED CIRCUITS 16 16-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB (Narrow Body, Thermally Enhanced) millimeters(inches) Package Type: 16HNE BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 0to 8 ° Detail A .033 ± .017 (.838 ± .43) °° 1.75 (0.069) 0.410 ± 0.100 (0.016 ± 0.004) 9.90 (0.390) 0.175 ± 0.075 (0.007 ± 0.003) See Detail A 3.90 (0.154) Top View Bottom View 2.045 ± 0.365 (0.081 ± 0.014) 1.27 (0.05) BSC 0.075 ± 0.075 (0.003 ± 0.003) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal dissipation. BSC BSC 6.00 (0.236) BSC 4.215 ± 0.355 (0.166 ± 0.014) max |
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