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MWS11 数据表(PDF) 2 Page - Microsemi Corporation

部件名 MWS11
功能描述  InGaP HBT Gain Block
PDF  6 Pages
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制造商  MICROSEMI [Microsemi Corporation]
网页  http://www.microsemi.com
标志 MICROSEMI - Microsemi Corporation

MWS11 数据表(HTML) 2 Page - Microsemi Corporation

  MWS11 Datasheet HTML 1Page - Microsemi Corporation MWS11 Datasheet HTML 2Page - Microsemi Corporation MWS11 Datasheet HTML 3Page - Microsemi Corporation MWS11 Datasheet HTML 4Page - Microsemi Corporation MWS11 Datasheet HTML 5Page - Microsemi Corporation MWS11 Datasheet HTML 6Page - Microsemi Corporation  
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C
C O
O N
N F
F II D
D E
E N
N T
T II A
A L
L
Microsemi
11861 Western Avenue, Garden Grove, CA. 92841. Tel: (714) 898-8121
Page 2
Copyright
© 2000
Rev. 0.2,2000-12-15
MWS11-GB11-xx
InGaP HBT Gain Block
PREVIEW
A
M I CROSEM I
COM P A N Y
  
   

DC Supply Voltage..................................................................................................5.0 Vdc
Absolute Max. Limit...................................................................................................60mA
RF Input Power (Pin)...............................................................................................10 dBm
Operating Case Temperature ..........................................................................-40º to +85ºC
Storage Temperature.....................................................................................-60º to +150ºC
Note:
Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
 
 
PK
Plastic SOT-89 3-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
XX
°C/W
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
149°C/W
THERMAL RESISTANCE-JUNCTION TO LEAD,
θ
JT
XX
°C/W
Gigamite
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
XX
°C/W
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
XX
°C/W
THERMAL RESISTANCE-JUNCTION TO LEAD,
θ
JT
XX
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
   
   
12
3
RF IN
GN D
RF O U T /
BIAS
Ta b is
GN D
PK PACKAGE
(Top View)
  
   

 
  
RF IN
RF Input pin. A DC blocking capacitor should be used in most applications.
GND
Ground connection. Traces should be minimized and connect immediately to ground.
RF OUT /
BIAS
RF output and bias pin. In the bias network, a resistor is selected to set the DC current into this pin as:
()
CC
D
CC
I
V
V
R
=
Note that maximum current limit ICC must not be exceeded and a resistor should always be used. A DC blocking
capacitor should also be used.



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