ISO7330C, ISO7330FC, ISO7331C, ISO7331FC

SLLSEK9B – JANUARY 2015 – REVISED APRIL 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.5

6

V

INx, OUTx, ENx

–0.5

(3)

V

±15

mA

150

°C

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal and are peak voltage values.

(3)

Maximum voltage must not exceed 6 V.

6.2 ESD Ratings

VALUE

UNIT

±4000

V

±1500

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

TYP

MAX

UNIT

Supply voltage

3

5.5

V

High-level output current

–4

mA

Low-level output current

4

mA

High-level input voltage

2

5.5

V

Low-level input voltage

0

0.8

V

Input pulse duration

40

ns

Signaling rate

0

25

Mbps

(1)

Junction temperature

136

°C

Ambient temperature

-40

25

125

°C

(1)

6.4 Thermal Information

DW PACKAGE

UNIT

(16) PINS

Junction-to-ambient thermal resistance

78.3

Junction-to-case (top) thermal resistance

40.9

Junction-to-board thermal resistance

42.9

°C/W

Junction-to-top characterization parameter

15.3

Junction-to-board characterization parameter

42.4

Junction-to-case (bottom) thermal resistance

N/A

Maximum Power Dissipation by ISO7330

70

Maximum Power Dissipation by Side-1 of ISO7330

15pF, Input a 12.5 MHz 50% duty cycle

20

mW

square wave

Maximum Power Dissipation by Side-2 of ISO7330

50

Maximum Power Dissipation by ISO7331

84

Maximum Power Dissipation by Side-1 of ISO7331

15pF, Input a 12.5 MHz 50% duty cycle

35

mW

square wave

Maximum Power Dissipation by Side-2 of ISO7331

49

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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