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NTMFS4926NET1G 数据表(PDF) 1 Page - ON Semiconductor

部件名 NTMFS4926NET1G
功能描述  Single N?묬hannel Power MOSFET
PDF  7 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

NTMFS4926NET1G 数据表(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2012
May, 2012 − Rev. 1
1
Publication Order Number:
NTMFS4926NE/D
NTMFS4926NE
Power MOSFET
30 V, 44 A, Single N−Channel, SO−8 FL
Features
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
Dual Sided Cooling Capability
Optimized for 5 V, 12 V Gate Drives
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
CPU Power Delivery
DC−DC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
30
V
Gate−to−Source Voltage
VGS
±20
V
Continuous Drain
Current RqJA
(Note 1)
Steady
State
TA = 25°C
ID
15.5
A
TA = 100°C
9.8
Power Dissipation
RqJA (Note 1)
TA = 25°C
PD
2.70
W
Continuous Drain
Current RqJA ≤ 10 s
(Note 1)
TA = 25°C
ID
23.4
A
TA = 100°C
14.8
Power Dissipation
RqJA ≤ 10 s (Note 1)
TA = 25°C
PD
6.13
W
Continuous Drain
Current RqJA
(Note 2)
TA = 25°C
ID
9.0
A
TA = 100°C
5.7
Power Dissipation
RqJA (Note 2)
TA = 25°C
PD
0.92
W
Continuous Drain
Current RqJC
(Note 1)
TC = 25°C
ID
44
A
TC =100°C
28
Power Dissipation
RqJC (Note 1)
TC = 25°C
PD
21.6
W
Pulsed Drain
Current
TA = 25°C, tp = 10 ms
IDM
182
A
Current Limited by Package
TA = 25°C
IDmax
100
A
Operating Junction and Storage
Temperature
TJ,
TSTG
−55 to
+150
°C
Source Current (Body Diode)
IS
21
A
Drain to Source DV/DT
dV/dt
6.0
V/ns
Single Pulse Drain−to−Source Avalanche
Energy (TJ = 25°C, VDD = 24 V, VGS = 10 V,
IL = 21 Apk, L = 0.1 mH, RG = 25 W)
EAS
22
mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
http://onsemi.com
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
4926NE
AYWZZ
1
V(BR)DSS
RDS(ON) MAX
ID MAX
30 V
7.0 mW @ 10 V
44 A
12.0 mW @ 4.5 V
N−CHANNEL MOSFET
Device
Package
Shipping
ORDERING INFORMATION
NTMFS4926NET1G
SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
NTMFS4926NET3G
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
S
S
S
G
D
D
D
D
G (4)
S (1,2,3)
D (5,6)


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