REF3012, REF3020, REF3025, REF3030, REF3033, REF3040

SBVS032G – MARCH 2002 – REVISED NOVEMBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, V+ to V–

7.0

V

Continuous

Operating temperature

–40

125

°C

Junction temperature

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Short circuit to ground.

7.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

V

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Input voltage

(1)

5.5

V

Load current

25

mA

Operating temperature

–40

125

°C

(1)

7.4 Thermal Information

REF30xx

DBZ (SOT-23)

UNIT

3 PINS

Junction-to-ambient thermal resistance

297.3

°C/W

Junction-to-case (top) thermal resistance

128.5

°C/W

Junction-to-board thermal resistance

91.7

°C/W

Junction-to-top characterization parameter

12.8

°C/W

Junction-to-board characterization parameter

90.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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