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AS5147P-HTST 数据表(PDF) 34 Page - ams AG |
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AS5147P-HTST 数据表(HTML) 34 Page - ams AG |
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34 / 40 page ![]() Page 34 ams Datasheet Document Feedback [v1-01] 2015-May-12 AS5147P − Mechanical Data Figure 45: DIe Placement and Hall Array Position Note(s) and/or Footnote(s): 1. Dimensions are in mm. 2. The Hall array center is located in the center of the IC package. Hall array radius is 1.1mm. 3. Die thickness is 203μm nominal. Hall radius 2.130±0.235 0.306±0.100 0.694±0.150 0.236±0.100 |
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