ADP2230

Data Sheet

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Figure 2. Pin Configuration

Table 5. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

SW1

Connection from MOSFET Power Switches to the Inductor for Buck 1.

2

VIN1

Analog and Power Voltage Input for Buck 1. Connect VIN1 to VIN2.

3

FB1

Output Voltage Feedback for Buck 1.

4

EN1

Precision Enable for Buck 1. Do not leave the EN1 pin floating.

5

AGND

Analog Ground.

6

SYNC

Frequency Synchronization. Drive SYNC high to force the device to operate in 2 MHz fixed PWM mode. Drive SYNC

low to force the device to operate in 2 MHz PSM/PWM automatic transitioning mode. Apply an external clock

between 1.5 MHz and 2.5 MHz to the SYNC pin to synchronize the ADP2230 switching to the applied external

clock. Do not leave the SYNC pin floating.

7

EN2

Precision Enable for Buck 2. Do not leave the EN2 pin floating.

8

FB2

Output Voltage Feedback for Buck 2.

9

VIN2

Analog and Power Voltage Input for Buck 2. Connect VIN2 to VIN1.

10

SW2

Connection from MOSFET Power Switches to the Inductor for Buck 2.

11

EPAD

Exposed Pad, Power Ground (PGND). The exposed pad on the bottom of the LFCSP package enhances thermal

performance and is electrically connected to PGND inside the package. The exposed pad must be connected to the

ground plane on the board for proper operation.

1

SW1

2

VIN1

3

FB1

4

EN1

5

AGND

10 SW2

NOTES

1. THE EXPOSED PAD ON THE BOTTOM OF

THE LFCSP PACKAGE ENHANCES

THERMAL PERFORMANCE AND IS

ELECTRICALLY CONNECTED TO PGND

INSIDE THE PACKAGE. THE EXPOSED

PAD MUST BE CONNECTED TO THE

GROUND PLANE ON THE BOARD FOR

PROPER OPERATION.

9

VIN2

8

FB2

7

EN2

6

SYNC

ADP2230

TOP VIEW

11

PGND

Rev. A | Page 6 of 18