 2011 - 2015 Microchip Technology Inc.

DS00001725D-page 11

USB3740B

FIGURE 6-3:

10-PIN, 1.3MM X 1.8MM QFN PACKAGE LAND PATTERN

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.40 BSC

MIN

E

MAX

1.70

Contact Pad Length (X4)

Contact Pad Width (X10)

Y2

X

0.80

0.20

Microchip Technology Drawing C04-2386A

NOM

SILK SCREEN

1

2

20

C1

Contact Pad Spacing

1.10

Contact Pad to Pad (X4)

G2

0.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

C1

C2

Y2

Y1

G2

G1

E

X

Contact Pad Length (X6)

Y1

0.70

Contact Pad to Pad (X6)

G1

0.20

10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2V) - 1.3x1.8x0.6 mm Body

[UQFN] Chip-On-Lead