USB3740B

DS00001725D-page 14

 2011 - 2015 Microchip Technology Inc.

FIGURE 6-6:

10-PIN, 1.6MM X 2.1MM QFN PACKAGE LAND PATTERN

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.50 BSC

MIN

E

MAX

2.075

Contact Pad Length (X6)

Contact Pad Width (X10)

Y1

X1

0.825

0.30

Microchip Technology Drawing C04-2381A

NOM

10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (3V) - 1.6.x2.1 mm Body [UQFN

SILK SCREEN

1

2

10

C1

Contact Pad Spacing

1.325

Contact Pad to Center Pad (X6)

G1

0.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

e

e

C2

6X Y1

4X Y2

C1

10X X1

6X G1

Contact Pad Length (X4)

Y2

1.075

Chip-On-Lead