 2011 - 2015 Microchip Technology Inc.

DS00001725D-page 15

USB3740B

APPENDIX A:

DATA SHEET REVISION HISTORY

TABLE A-1:

REVISION HISTORY

Revision

Section/Figure/Entry

Correction

DS00001725D (03-11-15)

Section 6.0, "Package

Outlines," on page 9

Updated 1.6x2.1 UQFN and 1.3x1.8 UQFN

package drawings.

DS00001725C (12-11-14)

Cover

Added bullet: “Automotive option (1.6 x 2.1mm,

0.5mm pitch package only)“

Added sub-bullet: “8kV HBM”

FIGURE 6-1: 10-pin, 1.3mm

x 1.8mm QFN Package

Outline on page 9 and

FIGURE 6-4: 10-pin, 1.6mm

x 2.1mm QFN Package

Outline on page 12

Updated package drawings to latest revision C

Product Identification

System

Added automotive ordering code information.

Added tape and reel quantity information.

Section 2.1, "Pin Diagram,"

on page 5

Clarified which package is available for the

automotive option.

All: Cover, Order Codes

Made operating temperature references generic

“-40°C to +85°C”

DS00001725B (08-21-14)

Document is converted to Microchip template; Product Identification System page

replaces Ordering Information.

DS00001725A replaces the

previous SMSC version,

Rev. 1.2

Title changed from “High Speed Switch for Mobile

and Portable Applications” to “High Speed USB 2.0

Switch with ESD Protection and Low Standby

Current”

Rev. 1.2 (07-30-12)

Table 3-1, “Absolute

Maximum Ratings,” on

page 6

Corrected “Any other pin to GND” row’s rating to “-

0.3 to VDD+0.5V”

Rev. 1.1 (12-15-11)

Section 2.2, "Ball/Pin

Definitions"

In Section 2.2, changed the description of Pin #8

as follows: “Ground”

Rev. 1.0 (08-03-11)

Data Sheet Release