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DALC208SC6Y 数据表(PDF) 7 Page - STMicroelectronics |
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DALC208SC6Y 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 12 page ![]() DALC208SC6Y Package information Doc ID 16362 Rev 1 7/12 3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. Footprint (dimensions in mm) Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Table 4. SOT23-6L dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.45 0.035 0.057 A1 0 0.10 0 0.004 A2 0.90 1.30 0.035 0.051 b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008 D 2.80 3.05 0.11 0.118 E 1.50 1.75 0.059 0.069 e0.95 0.037 H 2.60 3.00 0.102 0.118 L 0.10 0.60 0.004 0.024 0° 10° 0° 10° A2 A L H c b E D e e A1 θ 0.95 0.60 1.20 1.10 3.50 2.30 |
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