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L6984 数据表(PDF) 5 Page - STMicroelectronics |
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L6984 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 34 page ![]() DocID025378 Rev 3 5/34 L6984 Pin settings 34 1.3 Maximum ratings Stressing the device above the rating listed in Table 2: Absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in Table 5 of this specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Table 2. Absolute maximum ratings 1.4 Thermal data Table 3. Thermal data Symbol Description Min. Max. Unit VIN see Table 1 -0.3 40 V EN -0.3 VIN + 0.3 LX TON VCC -0.3 6 VBIAS PGOOD -0.3 VCC + 0.3 FB LNM TJ Operating temperature range -40 150 °C TSTG Storage temperature range -55 to 150 TLEAD Lead temperature (soldering 10 sec.) 260 IHS, ILS High-side RMS switch current 420 mA Low-side RMS switch current 500 Symbol Parameter Value Unit Rth JA Thermal resistance junction ambient (device soldered on the STMicroelectronics® evaluation board) 50 C/W |
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