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STM32F401CB 数据表(PDF) 127 Page - STMicroelectronics |
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STM32F401CB 数据表(HTML) 127 Page - STMicroelectronics |
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127 / 134 page  DocID024738 Rev 5 127/134 STM32F401xB STM32F401xC Package information 130 Figure 59. UFGBA100 recommended footprint ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 85. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask reg- istration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 84. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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