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STP33N60DM2 数据表(PDF) 3 Page - STMicroelectronics |
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STP33N60DM2 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 20 page ![]() STB33N60DM2, STP33N60DM2, STW33N60DM2 Electrical ratings DocID026854 Rev 2 3/20 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID Drain current (continuous) at Tcase = 25 °C 24 A Drain current (continuous) at Tcase = 100 °C 15.5 IDM(1) Drain current (pulsed) 96 A PTOT Total dissipation at Tcase = 25 °C 190 W dv/dt(2) Peak diode recovery voltage slope 50 V/ns dv/dt(3) MOSFET dv/dt ruggedness 50 Tstg Storage temperature -55 to 150 °C Tj Operating junction temperature Notes: (1) Pulse width is limited by safe operating area. (2) ISD ≤ 24 A, di/dt=900 A/μs; VDS peak < V(BR)DSS, VDD = 400 V. (3) VDS ≤ 480 V. Table 3: Thermal data Symbol Parameter Value Unit D²PAK TO-220 TO-247 Rthj-case Thermal resistance junction-case 0.66 °C/W Rthj-pcb Thermal resistance junction-pcb(1) 30 Rthj-amb Thermal resistance junction-ambient 62.5 50 Notes: (1)When mounted on 1 inch² FR-4, 2 Oz copper board. Table 4: Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive (Pulse width limited by Tjmax) 5.5 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 570 mJ |
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