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STP3NK50Z 数据表(PDF) 5 Page - STMicroelectronics |
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STP3NK50Z 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 14 page ![]() DocID025103 Rev 1 5/14 STP3NK50Z Electrical characteristics 14 The built-in back-to-back Zener diodes have been specifically designed to enhance not only the device’s ESD capability, but also to make them capable of safely absorbing any voltage transients that may occasionally be applied from gate to source. In this respect, the Zener voltage is appropriate to achieve efficient and cost-effective protection of device integrity. The integrated Zener diodes thus eliminate the need for external components. Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current - 2.3 A ISDM (1) 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5% Source-drain current (pulsed) - 9.2 A VSD (2) 2. Pulse width limited by safe operating area Forward on voltage ISD= 2.3 A, VGS=0 - 1.6 V trr Reverse recovery time ISD= 2.3 A, VDD= 40 V di/dt = 100 A/µs, (see Figure 17) - 250 ns Qrr Reverse recovery charge - 745 nC IRRM Reverse recovery current - 6 A trr Reverse recovery time ISD= 12 A,VDD= 40 V di/dt=100 A/µs, Tj=150 °C (see Figure 17) - 300 ns Qrr Reverse recovery charge - 960 nC IRRM Reverse recovery current - 6.2 A Table 8. Gate-source Zener diode Symbol Parameter Test conditions Min Typ. Max. Unit V(BR)GSO Gate-source breakdown voltage IGS = ± 1mA, ID=0 30 - - V |
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