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ABSOLUTE MAXIMUM RATINGS

DAC8830-EP

DAC8831-EP

SGLS334C – AUGUST 2006 – REVISED APRIL 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because small parametric changes could cause the device not to meet its published specifications.

MINIMUM

POWER-

RELATIVE

DIFFERENTIAL

ON

SPECIFICATION

TRANSPORT

ACCURACY

NONLINEARITY

RESET

TEMPERATURE

PACKAGE

PACKAGE-

PACKAGE

(2)

ORDERING

MEDIA,

PRODUCT

(LSB)

(LSB)

VALUE

RANGE

MARKING

LEAD

DESIGNATOR

NUMBER

QUANTITY

Tape and Reel,

DAC8830MCDREP

2500

DAC8830MCD

±1

±1

Zero-Code

–55

°C to 125°C

8830M

SO-8

D

DAC8830MCDEP

Tube, 75

Tape and Reel,

DAC8831MCDREP

2500

DAC8831MCD

±1

±1

Zero-Code

–55

°C to 125°C

8831M

SO-14

D

DAC8831MCDEP

Tube, 50

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the

Texas Instruments website at www.ti.com.

(2)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

–0.3 to 7

V

Digital input voltage to DGND

V

V

AGND, AGNDF, AGNDS to DGND

–0.3 to 0.3

V

Operating temperature range

–55 to 125

°C

Storage temperature range

–65 to 150

°C

150

°C

Power dissipation

W

SO-8

149.5

°C/W

Thermal impedance,

SO-14

104.5

°C/W

Vapor phase (60 s)

215

°C

Lead temperature, soldering

Infrared (15 s)

220

°C

(1)

Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

3

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