VOLUME

CONTROL AND

MIXER

IN_+

IN_-

OUT_

LM48822, LM48822TLEVAL

www.ti.com

SNAS456C – MAY 2008 – REVISED MAY 2013

Figure 26. Single-Ended Input Configuration

PCB LAYOUT CONFIGURATION

Minimize trace impedance of the power, ground and all output traces for optimum performance. Voltage loss due

to trace resistance between the LM48822 and the load results in decreased output power and efficiency. Trace

resistance between the power supply and ground has the same effect as a poorly regulated supply, increased

ripple and reduced peak output power. Use wide traces for power supply inputs and amplifier outputs to minimize

losses due to trace resistance, as well as route heat away from the device. Proper grounding improves audio

performance, minimizes crosstalk between channels and prevents switching noise from interfering with the audio

signal. Use of power and ground planes is recommended.

Place all digital components and route digital signal traces as far as possible from analog components and

traces. Do not run digital and analog traces in parallel on the same PCB layer. If digital and analog signal lines

must cross either over or under each other, ensure that they cross in a perpendicular fashion.

LM48822TL Demoboard of Materials

Table 5. LM48822TL Demoboard Bill of Materials

Designator

Quantity

Description

10µF ±10% 16V 500

Ω Tantalum Capacitor (B Case) AVX

C1

1

TPSB106K016R0500

1

μF ±10% 16V X5R Ceramic Capacitor (603) Panasonic

C2

1

ECJ-1VB1C105K

2.2

μF ±10% 10V X5R Ceramic Capacitor (603) Panasonic

C3, C8, C9

3

ECJ-1VB1A225K

1

μF ±10% 16V X7R Ceramic Capacitor (1206) Panasonic

C4 — C7

4

ECJ-3YB1C105K

5k

Ω ±5% 1/10W Thick Film Resistor (603) Vishay

R1, R2

2

CRCW06035R1KJNEA

J1

1

Stereo Headphone Jack

J2

1

16-Pin Boardmount Socket 3M 8516-4500JL

JU1

1

3 Pin Header

JU2

1

2 Pin Header

LM4822TL

1

LM48822TL (16-Bump DSBGA)

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