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STV7697B 数据表(PDF) 9 Page - STMicroelectronics |
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STV7697B 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 18 page ![]() 9/18 STV7697B Electrical Characteristics 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Note:1. Through one power output. 2. Through one power output with VPP = VSSP (See Figure 4.) 3. These parameters are measured during ST’s internal qualification which includes temperature characterization on standard batches and on corners batches of the process. These parameters are not tested on the parts. 3.2 Thermal Data Note:1. TQFP soldered on 4-layer printed circuit board. Symbol Parameter Value Units VCC Logic Supply −0.3, +7 V VPP Driver Supply −0.3, +170 V VIN Logic Input Voltage −0.3, V CC +0.3 V VOUT Logic Output Voltage −0.3, V CC + 0.3 V VPOUT Driver Output Voltage (Scanning mode) −0.3, V PP V IPOUT Driver Output Current (See Note 1 and Note 3) −250, +800 mA IDOUT Diode Output Current (See Note 2 and Note 3) ±1.2 A IL Latch-up Susceptibility ±200 mA TJMAX Junction Temperature +125 °C TOPER Operating Temperature −20, +85 °C TSTG Storage Temperature −50, +150 °C Symbol Parameter Value Units TJOPER Maximum Operating Junction 125 °C RthJA Junction-ambient Thermal Resistance (See Note 1)40 °C/W POPER Operating Power Dissipation (TOPER = 25° C) 2W |
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