TLC080IP datasheet(20/53 Pages) TI1

20 / 53 page

DIE

Side View (a)

End View (b)

Bottom View (c)

DIE

Thermal

Pad

TLC080 , TLC081, TLC082

TLC083, TLC084, TLC085, TLC08xA

SLOS254F

– JUNE 1999 – REVISED DECEMBER 2011

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General PowerPAD Design Considerations

The TLC08x is available in a thermally-enhanced PowerPAD family of packages. These packages are

constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This

arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see

Figure 52(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance

can be achieved by providing a good thermal path away from the thermal pad.

The thermal pad is electrically isolated from all terminals in the package.

Figure 52. Views of Thermally-Enhanced DGN Package

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat dissipating device.

Soldering the PowerPAD to the printed circuit board (PCB) is always required, even with applications

that have low power dissipation. This soldering provides the necessary thermal and mechanical connection

between the lead frame die pad and the PCB.

Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the

recommended approach.

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Product Folder Link(s): TLC080 TLC081 TLC082 TLC083 TLC084 TLC085 TLC08xA

TLC080IP 数据表(PDF) 20 Page - Texas Instruments