TLC080IP datasheet(22/53 Pages) TI1

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TJ = 150°C

-55 -40

-10

20 3

125

DGN Package

Low-K Test PCB

θJA = 52.3°C/W

SOT-23 Package

Low-K Test PCB

θJA = 324°C/W2

-25

5 50

110

PWP Package

Low-K Test PCB

θJA = 29.7°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

PDIP Package

Low-K Test PCB

θJA = 104°C/W

T – Free-Air Temperature – C

TLC080 , TLC081, TLC082

TLC083, TLC084, TLC085, TLC08xA

SLOS254F

– JUNE 1999 – REVISED DECEMBER 2011

www.ti.com

Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 53. Maximum Power Dissipation vs Free-Air Temperature

The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent

power and output power. The designer should never forget about the quiescent heat generated within the device,

especially multi-amplifier devices. Because these devices have linear output stages (Class A-B), most of the heat

dissipation is at low output voltages with high output currents.

The other key factor when dealing with power dissipation is how the devices are mounted on the PCB. The

PowerPAD devices are extremely useful for heat dissipation. But, the device should always be soldered to a

copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC package, on the other

hand, is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around the

device,

θJA decreases and the heat dissipation capability increases. The currents and voltages shown in these

graphs are for the total package. For the dual or quad amplifier packages, the sum of the RMS output currents

and voltages should be used to choose the proper package.

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Product Folder Link(s): TLC080 TLC081 TLC082 TLC083 TLC084 TLC085 TLC08xA

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