LP8550

SNVS657E – SEPTEMBER 2010 – REVISED SEPTEMBER 2014

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7.4 Thermal Information

DSBGA

UNIT

25 PINS

40 - 73

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

7.5

Electrical Characteristics

(1) (2)

= 10

(3)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Internal LDO disabled

μA

Standby supply current

EN=L and PWM=L

LDO enabled, boost enabled, no current

going through LED outputs

3

5-MHz PLL Clock

Normal mode supply current

mA

10-MHz PLL Clock

3.7

20-MHz PLL Clock

4.7

40-MHz PLL Clock

6.7

Internal oscillator frequency

–4%

4%

accuracy

Internal LDO voltage

5

V

Internal LDO external loading

5

mA

(1)

All voltages are with respect to the potential at the GND pins.

(2)

Minimum (MIN) and Maximum (MAX) limits are specified by design, test, or statistical analysis. Typical numbers represent the most

likely norm.

(3)

Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.

(4)

Limits apply over the full operating ambient temperature range (–30°C

7.6

Boost Converter Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Switch ON resistance

0.12

Ω

Boost maximum output voltage

40

V

9 V

450

Maximum continuous load current

6 V

300

mA

3 V

180

Conversion ratio

10

BOOST_FREQ = 00

156

BOOST_FREQ = 01

312

Switching frequency

kHz

BOOST_FREQ = 10

625

BOOST_FREQ = 11

1250

Overvoltage protection voltage

V

Switch pulse minimum width

no load

50

ns

Start-up time

6

ms

BOOST_IMAX = 0

1.4

SW pin current limit

A

BOOST_IMAX = 1

2.5

(1)

6

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