2004 July 12

24

Philips Semiconductors

Product specification

IC card interface

TDA8024

14 PACKAGE OUTLINES

UNIT

A

max.

cD

(1)

E

(1)

(1)

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

2.65

0.3

0.1

2.45

2.25

0.49

0.36

0.32

0.23

18.1

17.7

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT136-1

X

14

28

θ

A

D

Q

detail X

E

Z

c

L

e

15

1

(A )

3

A

y

0.25

075E06

MS-013

pin 1 index

0.1

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.71

0.69

0.30

0.29

0.05

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0

5

10 mm

scale

SO28: plastic small outline package; 28 leads; body width 7.5 mm

SOT136-1

99-12-27

03-02-19