2004 July 12

25

Philips Semiconductors

Product specification

IC card interface

TDA8024

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

9.8

9.6

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.8

0.5

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT361-1

MO-153

99-12-27

03-02-19

0.25

Z

e

114

28

15

pin 1 index

θ

A

Q

detail X

L

(A )

3

E

c

X

A

D

y

0

2.5

5 mm

scale

TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

SOT361-1

A

max.

1.1