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LM93 数据表(PDF) 28 Page - National Semiconductor (TI) |
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LM93 数据表(HTML) 28 Page - National Semiconductor (TI) |
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28 / 92 page ![]() 15.0 Using The LM93 (Continued) Thermal Diode Temperature vs. LM93 Temperature Reading 20068215 15.9.1 Accuracy Effects of Diode Non-Ideality Factor The technique used in today’s remote temperature sensors is to measure the change in V BE at two different operating points of a diode. For a bias current ratio of N:1, this differ- ence is given as: where: - η is the non-ideality factor of the process the diode is manufactured on, - q is the electron charge, - k is the Boltzmann’s constant, - N is the current ratio, - T is the absolute temperature in ˚K. The temperature sensor then measures ∆V BE and converts to digital data. In this equation, k and q are well defined universal constants, and N is a parameter controlled by the temperature sensor. The only other parameter is η, which depends on the diode that is used for measurement. Since ∆V BE is proportional to both η and T, the variations in η cannot be distinguished from variations in temperature. Since the non-ideality factor is not controlled by the tempera- ture sensor, it directly adds to the inaccuracy of the sensor. For example, assume a ±1% variation in η from part to part (Xeon processors targeted for the LM93 do not have pub- lished thermal diode specifications at the time of this printing, therefore this is probably a very conservative estimate). Assume a temperature sensor has an accuracy specification of ±3˚C at room temperature of 25˚C and the process used to manufacture the diode has a non-ideality variation of ±1%. The resulting accuracy of the temperature sensor at room temperature is: TACC = ±3˚C+(±1% of 298˚K) = ±6˚C The additional inaccuracy in the temperature measurement caused by η, can be eliminated if each temperature sensor is calibrated with the remote diode that it is paired with. The LM93 can be paired with an MMBT3904 when not being used to monitor the thermal diode within an Intel Processor. 15.9.2 PCB Layout for Minimizing Noise In the following guidelines, D+ and D− refer to the RE- MOTE1+, REMOTE1−, REMOTE2+, REMOTE2− pins. In a noisy environment, such as a power supply, layout considerations are very critical. Noise induced on traces running between the remote temperature diode sensor and the LM93 can cause temperature conversion errors. The following guidelines should be followed: 1. Place a 0.1 µF and 100 pF LM93 power bypass capaci- tors as close as possible to the V DD pin, with the 100pF capacitor being the closest. Place 10 µF capacitor in the near vicinity of the LM93 power pin. 2. Place 100 pF capacitor as close as possible to the LM93 thermal diode Remote+ and Remote− pins. Make sure the traces to the 100 pF capacitor are matched and as short as possible. This capacitor is required to minimize high frequency noise error. 3. Ideally, the LM93 should be placed within 10 cm of the thermal diode pins with the traces being as straight, short and identical as possible. Trace resistance of 1 Ω can cause as much as 1˚C of error. 4. Diode traces should be surrounded by a GND guard ring to either side, above and below, if possible. This GND guard should not be between the Remote+ and Remote− lines. In the event that noise does couple to the diode lines, it would be ideal if it is coupled to both identically, i.e. common mode. That is, equally to the Remote+ (D+) and Remote−(D-) lines. (See figure be- low): Recommended Diode Trace Layout 20068220 5. Avoid routing diode traces in close proximity to any power supply switching or filtering inductors. 6. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be kept at least 2 cm apart from the high speed digital traces. 7. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should cross at a 90 degree angle. 8. Leakage current between Remote+ and GND should be kept to a minimum. 1 nA of leakage can cause as much as 1˚C of error in the diode temperature reading. Keep- ing the printed circuit board as clean as possible mini- mizes leakage current. 15.10 FAN CONTROL 15.10.1 Automatic Fan Control Algorithm The LM93 fan speed control method is optimized for fan power efficiency, fan reliability and minimum cost. The PWMx outputs can be filtered using an external switching regulator type output stage that provides 5V to 12V DC for fan power. A high PWM frequency is required to minimize the www.national.com 28 |
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