MCP2221 datasheet(62/80 Pages) MICROCHIP

62 / 80 page

MCP2221

DS20005292B-page 62

 2015 Microchip Technology Inc.

TABLE 4-2:

THERMAL CONSIDERATIONS

Standard Operating Conditions (unless otherwise stated)

Operating temperature: -40

C  TA  +85C (I-Temp)

Param.

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

θJA

Thermal Resistance Junction

to Ambient

C/W 14-pin PDIP package

95.3

C/W 14-pin SOIC package

100

C/W 14-pin TSSOP package

45.7

C/W 16-pin QFN 4 x 4 mm package

TH02

θJC

Thermal Resistance Junction

to Case

C/W 14-pin PDIP package

C/W 14-pin SOIC package

24.4

C/W 14-pin TSSOP package

6.3

C/W 16-pin QFN 4 x 4 mm package

TH03

TJMAX

Maximum Junction Temperature

+150

C

TH04

Power Dissipation

—

PD = PINTERNAL +PI/O

TH05

PINTERNAL Internal Power Dissipation

—

PINTERNAL =IDD xVDD(1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

(IOL xVOL)+ (IOH x(VDD –VOH))

TH07

PDER

Derated Power

—

PDER =PDMAX (TJ –TA)/θJA(2, 3)

Note 1: IDD is the current to run the device alone without driving any load on the output pins.

2: TA = Ambient Temperature.

3: TJ = Junction Temperature.

MCP2221 数据表(PDF) 62 Page - Microchip Technology

MCP2221 数据表(HTML) 62 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80

数据表下载