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TPS61253_016 数据表(PDF) 29 Page - Texas Instruments

部件名 TPS61253_016
功能描述  TPS6125x 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging
PDF  37 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TPS61253_016 数据表(HTML) 29 Page - Texas Instruments

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A1
B1
C1
A2
B2
D
E
C2
A3
B3
C3
YMS
CC
LLLL
A1
29
TPS61253, TPS61254, TPS61256, TPS61258, TPS61259, TPS612592
www.ti.com
SLVSAG8G – SEPTEMBER 2011 – REVISED JUNE 2016
Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259 TPS612592
Submit Documentation Feedback
Copyright © 2011–2016, Texas Instruments Incorporated
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14.1 Package Summary
Chip Scale Package
(Bottom View)
Chip Scale Package
(Top View)
Code:
YM - 2 digit date code
S - assembly site code
CC - chip code (see ordering table)
LLLL - lot trace code
14.1.1 Package Dimensions
The dimensions for the YFF-9 package are shown in Table 6. See the package drawing at the end of this data
sheet.
Table 6. YFF-9 Package Dimensions
PACKAGED DEVICES
D
E
TPS6125xYFF
max = 1.236mm; min = 1.176 mm
max = 1.336 mm, min = 1.276 mm



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