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TPS61253_016 数据表(PDF) 29 Page - Texas Instruments |
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TPS61253_016 数据表(HTML) 29 Page - Texas Instruments |
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29 / 37 page ![]() A1 B1 C1 A2 B2 D E C2 A3 B3 C3 YMS CC LLLL A1 29 TPS61253, TPS61254, TPS61256, TPS61258, TPS61259, TPS612592 www.ti.com SLVSAG8G – SEPTEMBER 2011 – REVISED JUNE 2016 Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259 TPS612592 Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14.1 Package Summary Chip Scale Package (Bottom View) Chip Scale Package (Top View) Code: • YM - 2 digit date code • S - assembly site code • CC - chip code (see ordering table) • LLLL - lot trace code 14.1.1 Package Dimensions The dimensions for the YFF-9 package are shown in Table 6. See the package drawing at the end of this data sheet. Table 6. YFF-9 Package Dimensions PACKAGED DEVICES D E TPS6125xYFF max = 1.236mm; min = 1.176 mm max = 1.336 mm, min = 1.276 mm |
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