TPS61253_016 datasheet(6/37 Pages) TI1

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TPS61253, TPS61254, TPS61256, TPS61258, TPS61259, TPS612592

SLVSAG8G – SEPTEMBER 2011 – REVISED JUNE 2016

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Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259 TPS612592

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For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TPS6125x

UNIT

YFF

9 PINS

RθJA

Junction-to-ambient thermal resistance

108.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1.0

RθJB

Junction-to-board thermal resistance

ψJT

Junction-to-top characterization parameter

4.2

ψJB

Junction-to-board characterization parameter

17.9

7.5 Electrical Characteristics

Minimum and maximum values are at VIN = 2.3V to 5.5V, EN = 1.8V, TA = –40°C to 85°C; Circuit of Parameter Measurement

Information section (unless otherwise noted). Typical values are at VIN = 3.6V, EN = 1.8V, TA = 25°C (unless otherwise

noted).

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY CURRENT

Operating quiescent current

into VIN Operating quiescent current

into VOUT Standby mode quiescent current

into VIN Standby mode quiescent current

into VOUT

IOUT = 0mA, VIN = 3.6V

EN = VIN, BP = GND

Device not switching

µA

IOUT = 0mA, VIN = VOUT = 3.6V

EN = GND, BP = VIN

Device not switching

µA

9.5

µA

ISD

Shutdown current

EN = GND, BP = GND

0.85

5.0

μA

VUVLO

Under-voltage lockout threshold

Falling

2.0

2.1

Hysteresis

0.1

ENABLE, BYPASS

VIL

Low-level input voltage

0.4

VIH

High-level input voltage

1.0

Ilkg

Input leakage current

Input connected to GND or VIN

0.5

µA

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