CAT6243

www.onsemi.com

13

PACKAGE DIMENSIONS

WDFN6 3x3, 0.95P

CASE 511AP

ISSUE O

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

PIN 1

REFERENCE

A

B

C

0.15

2X

2X

TOP VIEW

D

E

C

0.15

NOTES:

1. DIMENSIONS AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMESNION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND 0.30

MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

E2

BOTTOM VIEW

b

0.10

6X

L

13

0.05

C AB

C

D2

4X

e

K

64

6X

6X

(A3)

C

C

0.08

7X

C

0.10

SIDE VIEW

A1

A

SEATING

PLANE

DIM

MIN

MAX

MILLIMETERS

A

0.70

0.80

A1

0.00

0.05

A3

0.20 REF

b

0.35

0.45

D

3.00 BSC

D2

2.40

2.60

E

3.00 BSC

E2

1.50

1.70

e

0.95 BSC

K

0.20

−−−

L

0.30

0.50

NOTE 3

DETAIL B

DETAIL A

2.60

3.30

0.95

0.45

6X

1.70

DIMENSIONS: MILLIMETERS

1

0.63

6X

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

A1

A3

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

L1

−−−

0.15

PITCH

PKG

OUTLINE