CAT6243

www.onsemi.com

14

PACKAGE DIMENSIONS

DPAK−5 (TO−252, 5 LEAD)

CASE 369AE

ISSUE A

DIM

MIN

MAX

MILLIMETERS

E

6.35

6.80

A

2.10

2.50

b

0.40

0.60

c2

0.40

0.60

e

1.27 BSC

H

9.50

10.20

D1

4.80

5.10

A1

0.00

0.13

c

0.40

0.60

E

D

b

L

1.39

1.78

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

DIMENSIONS: MILLIMETERS

5.70

5X

10.50

6.00

2.10

0.80

1.27

PITCH

SOLDERING FOOTPRINT*

A1

C

H

L

DETAIL A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. THERMAL PAD CONTOUR OPTIONAL, WITHIN

DIMENSIONS SHOWN.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR BURRS. MOLD

FLASH, PROTRUSIONS OR GATE BURRS SHALL

NOT EXCEED 0.15mm PER SIDE.

5. DIMENSIONS D AND E ARE DETERMINED AT THE

OUTERMOST EXTREMES OF THE PLASTIC BODY.

6. DATUMS A AND B ARE DETERMINED AT DATUM

PLANE H.

D

5.40

6.30

A

A

M

0.12

C

c2

c

A

DETAIL A

BOTTOM VIEW

SIDE VIEW

TOP VIEW

b2

5.14

5.54

E1

L1

2.50

2.90

L2

0.51 BSC

5X

H

B

b2

B

C

E1

D1

L1

0.10 C

GUAGE

PLANE

2

13

4

5

BOTTOM VIEW

ALTERNATE

CONSTRUCTION

5.04

REF

2.74

REF

L2

e

4.75

5.05