Data Sheet

9

Rev. 1.1, 2016-01-28

TLE7183QU

General Product Characteristics

Attention: Stresses above the ones listed here may cause permanent damage to the device. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Attention: Integrated protection functions are designed to prevent IC destruction under fault conditions

described in the data sheet. Fault conditions are considered as “outside” normal operating

range. Protection functions are not designed for continuous repetitive operation.

4.2

Functional Range

4.1.28

Lead soldering temperature

(1/16’’ from body)

–260

°C–

4.1.29

–260

°C–

Thermal Resistance

4.1.30

Junction to case

–5

K/W

–

Power Dissipation

4.1.31

–2

W

–

ESD Susceptibility

4.1.32

–2

kV

4.1.33

ESD Resistivity to GND

V

ESD

-500

500

V

4.1.34

ESD Resistivity Pin 1, 12, 13, 24, 25, 36,

37,48 (corner pins) to GND

V

ESD1, 12,

13, 24, 25, 36,

37, 48

-750

750

V

CDM4)

1) Not subject to production test, specified by design.

2) Reflow profile IPC/JEDEC J-STD-020C

3) ESD susceptibility HBM according to EIA/JESD 22-A 114B

4) ESD susceptibility, Charged Device Model “CDM” ESDA STM5.3.1

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

4.2.1

5.5

5.5

20

28

VDC

t<1s

4.2.2

D0

100

%

–

4.2.3

PWM frequency

0

25

kHz

Total gate charge

400nC

4.2.4

–30

µA

4.2.5

Quiescent current into VDH

–30

µA

4.2.6

Supply current at Vs

–

–

175

175

110

110

mA

40

°C ≤

T

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.