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REFLoW soLDERinG ChARACtERistiCs

Intesting,CreehasfoundXLampMK-RLEDstobecompatiblewithJEDECJ-STD-020C,usingtheparameterslistedbelow.Asageneral

guideline,Creerecommendsthatusersfollowtherecommendedsolderingprofileprovidedbythemanufacturerofthesolderpasteused.

NotethatthisgeneralguidelinemaynotapplytoallPCBdesignsandconfigurationsofreflowsolderingequipment.

Profile Feature

Lead-Free solder

Average Ramp-Up Rate (Ts

1.2 °C/second

Preheat: Temperature Min (Ts

min)

120°C

Preheat: Temperature Max (Ts

170°C

Preheat: Time (ts

65-150seconds

TimeMaintainedAbove:Temperature(TL)

217°C

TimeMaintainedAbove:Time(tL)

45-90seconds

Peak/ClassificationTemperature(Tp)

235-245°C

TimeWithin5 °CofActualPeakTemperature(tp)

20-40 seconds

Ramp-Down Rate

1-6°C/second

Time25 °CtoPeakTemperature

4 minutes max.

Note: All temperatures refer to the topside of the package, measured on the package body surface.

IPC/JEDECJ-STD-020C

T

P

T

L

Time

t 25˚C to Peak

Preheat

ts

t

S

t

P

25

Ramp-down

Ramp-up

Critical Zone

T

Ts

max

Ts

min