©2014 Silicon Storage Technology, Inc.

DS70005029C

07/15

27

2.4 GHz WLAN 802.11b,g,n, 256 QAM Power Amplifier

SST12LP15B

Data Sheet

Figure 27:12-contact Extremely-thin Quad Flat No-lead (XQFN)

Package Code: QXB

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-14012A Sheet 1 of 1

12-Lead Extremely Thin Quad Flatpack No-Leads (QXBE/F) - 2x2 mm Body [XQFN]

Note:

1. Complies with JEDEC JEP95 MO-220J, variant VEED-4 except external paddle nominal dimensions and

pull-back of terminals from body edge.

2. The topside pin #1 indicator is laser engraved; its approximate shape and location is as shown.

3. From the bottom view, the pin #1 indicator may be either a curved indent or a 45-degree chamfer.

4. The external paddle is electrically connected to the die back-side and possibly to certain VSS leads.

This paddle must be soldered to the PC board; it is required to connect this paddle to the VSS of the unit.

Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction

of the device.

5. Untoleranced dimensions are nominal target dimensions.

6. All linear dimensions are in millimeters (max/min).