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BSC100N06LS3G 数据表(PDF) 2 Page - Infineon Technologies AG |
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BSC100N06LS3G 数据表(HTML) 2 Page - Infineon Technologies AG |
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2 / 9 page ![]() BSC100N06LS3 G Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Unit Power dissipation P tot T C=25 °C 50 W T A=25 °C, R thJA=50 K/W 2) 2.5 Operating and storage temperature T j, T stg -55 ... 150 °C IEC climatic category; DIN IEC 68-1 55/150/56 Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - case R thJC - - 2.5 K/W Device on PCB R thJA minimal footprint - - 62 6 cm 2 cooling area2) - - 50 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA 60 - - V Gate threshold voltage V GS(th) V DS=V GS, I D=23 µA 1.2 1.7 2.2 Zero gate voltage drain current I DSS V DS=60 V, V GS=0 V, T j=25 °C - 0.1 1 µA V DS=60 V, V GS=0 V, T j=125 °C - 10 100 Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=25 A - 11.8 17.9 m W V GS=10 V, I D=50 A - 7.8 10 Gate resistance R G - 1.3 - W Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=50 A 32 63 - S Value Values Rev. 2.3 page 2 2013-05-21 |
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