LSM6DS3US datasheet(15/104 Pages) STMICROELECTRONICS

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LSM6DS3US

Overview

104

Overview

The LSM6DS3US is a system-in-package featuring a high-performance 3-axis digital

accelerometer and 3-axis digital gyroscope.

The integrated power-efficient modes are able to reduce the power consumption down to

1.1 mA in high-performance mode, combining always-on low-power features with superior

sensing precision for an optimal motion experience for the consumer thanks to ultra-low

noise performance for both the gyroscope and accelerometer.

The LSM6DS3US delivers best-in-class motion sensing that can detect orientation and

gestures in order to empower application developers and consumers with features and

capabilities that are more sophisticated than simply orienting their devices to portrait and

landscape mode.

The event-detection interrupts enable efficient and reliable motion tracking and contextual

awareness, implementing hardware recognition of free-fall events, 6D orientation, tap and

double-tap sensing, activity or inactivity, and wakeup events.

The LSM6DS3US supports main OS requirements, offering real, virtual and batch mode

sensors. In addition, the LSM6DS3US can efficiently run the sensor-related features

specified in Android, saving power and enabling faster reaction time. In particular, the

LSM6DS3US has been designed to implement hardware features such as significant

motion, tilt, pedometer functions, timestamping and to support the data acquisition of an

external magnetometer with ironing correction (hard, soft).

The LSM6DS3US offers hardware flexibility to connect the pins with different mode

connections to external sensors to expand functionalities such as adding a sensor hub,

auxiliary SPI, etc. The application processor connection is supported by both SPI and I2C

interfaces for complete interface flexibility.

Up to 8 kbyte of FIFO [4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable)] with

dynamic allocation of significant data (i.e. external sensors, timestamp, etc.) allows overall

power saving of the system.

Like the entire portfolio of MEMS sensor modules, the LSM6DS3US leverages the robust

and mature in-house manufacturing processes already used for the production of

micromachined accelerometers and gyroscopes. The various sensing elements are

manufactured using specialized micromachining processes, while the IC interfaces are

developed using CMOS technology that allows the design of a dedicated circuit which is

trimmed to better match the characteristics of the sensing element.

The LSM6DS3US is available in a small plastic land grid array (LGA) package of

2.5 x 3.0 x 0.83 mm to address ultra-compact solutions.

LSM6DS3US 数据表(PDF) 15 Page - STMicroelectronics

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