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STM32F412RG 数据表(PDF) 164 Page - STMicroelectronics |
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STM32F412RG 数据表(HTML) 164 Page - STMicroelectronics |
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164 / 193 page ![]() Package information STM32F412xE/G 164/193 DocID028087 Rev 4 Device marking for WLCSP64 The following figure gives an example of topside marking and pin 1 position identifier location. Figure 62. WLCSP64 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm Table 99. WLCSP64 recommended PCB design rules (0.4 mm pitch) (continued) Dimension Recommended values |
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