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STM32F401CDU6 数据表(PDF) 85 Page - STMicroelectronics |
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STM32F401CDU6 数据表(HTML) 85 Page - STMicroelectronics |
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85 / 135 page ![]() Electrical characteristics STM32F401xB STM32F401xC 85/135 DocID024738 Rev 6 Table 47. Flash memory endurance and data retention 6.3.13 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: • Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard. • FTB: A burst of fast transient voltage (positive and negative) is applied to VDD and VSS through a 100 pF capacitor, until a functional disturbance occurs. This test is compliant with the IEC 61000-4-4 standard. A device reset allows normal operations to be resumed. The test results are given in Table 48. They are based on the EMS levels and classes defined in application note AN1709. Vprog Programming voltage 2.7 - 3.6 V VPP VPP voltage range 7 - 9 V IPP Minimum current sunk on the VPP pin 10 - - mA tVPP(3) Cumulative time during which VPP is applied - - 1 hour 1. Guaranteed by design. 2. The maximum programming time is measured after 100K erase operations. 3. VPP should only be connected during programming/erasing. Symbol Parameter Conditions Value Unit Min(1) 1. Guaranteed by characterization. NEND Endurance TA = –40 to +85 °C (6 suffix versions) TA = –40 to +105 °C (7 suffix versions) 10 kcycles tRET Data retention 1 kcycle(2) at TA = 85 °C 2. Cycling performed over the whole temperature range. 30 Years 1 kcycle(2) at TA = 105 °C 10 10 kcycles(2) at TA = 55 °C 20 Table 46. Flash memory programming with VPP voltage (continued) Symbol Parameter Conditions Min(1) Typ Max(1) Unit |
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