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USB2601 数据表(PDF) 24 Page - Microchip Technology |
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USB2601 数据表(HTML) 24 Page - Microchip Technology |
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24 / 30 page ![]() USB2601/USB2602 DS00002119A-page 24 2004 - 2016 Microchip Technology Inc. 7.1 Package Thermal Specifications TABLE 7-2: 128-PIN TQFP PACKAGE THERMAL PARAMETERS Parameter Symbol Value Unit Comments Thermal Resistance JA 53.1 oC/W From the die to the ambient air Junction-to-Top-of-Package JT 0.3 oC/W |
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