Datasheet SHT3x-DIS

www.sensirion.com

August 2016 - Version 3

17/20

Figure 15 Recommended metal land pattern (left) and stencil apertures (right) for the SHT3x-DIS. The dashed lines represent the

outer dimension of the DFN package. The PCB pads (left) and stencil apertures (right) are indicated through the shaded areas.

6 Shipping Package

Figure 16 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right and trailer tape to the

left on this drawing. Dimensions are given in millimeters.

1

0.55

0.3x45°

0.2

0.75

0.9

0.55

0.55

0.8

0.3

land pattern

stencil aperture

sensor outline

TOLERANCES - UNLESS

NOTED 1PL ±.2 2PL ±.10

A = 2.75

B = 2.75

K = 1.20

0

0

0

NOTES:

1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2

2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED

AS TRUE POSITION OF POCKET, NOT POCKET HOLE

3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"

ABOVE THE BOTTOM OF THE POCKET

A

0

K

0

B

0

R 0.25 TYP.

SECTION A - A

0.30 ±.05

A

R 0.2 MAX.

0.30 ±.05

2.00 ±.05 SEE Note 2

4.00

4.00 SEE Note 1

Ø1.5 +.1 /-0.0

Ø1.00 MIN

1.75 ±.1

12.0 +0.3/-0.1

5.50 ±.05

SEE NOTE 2

A

B

DETAIL B