ADLD8403

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

13.2 V

Power Dissipation

See Figure 3

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 3. Thermal Resistance

Package Type

Unit

20-Lead LFCSP (CP-20-10)

36.1

5.7

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADLD8403 is

limited by its junction temperature on the die.

The maximum safe junction temperature of plastic encapsulated

devices, as determined by the glass transition temperature of the

plastic, is 150°C. Exceeding this limit may temporarily cause a shift

in the parametric performance due to a change in the stresses

exerted on the die by the package. Exceeding this limit for an

extended period can result in device failure.

Figure 3 shows the maximum power dissipation in the package vs.

the ambient temperature for the 20-lead LFCSP on a JEDEC

6

0

1

2

3

4

5

–25

85

75

65

55

45

35

25

15

5

–5

–15

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Ambient Temperature

for a 4-Layer Board

taking the total power consumed while driving a signal and

subtracting the power dissipated in the load. The total power

consumed is simply the product of the voltage between the

Use rms voltages and currents.

addition, more copper in direct contact with the package leads

from PCB traces, through holes, ground, and power planes

ESD CAUTION

Rev. C | Page 4 of 10