AD8505/AD8506/AD8508

Rev. E | Page 19 of 20

COMPLIANT TO JEDEC STANDARDS MO-153-AB-1

8°

0°

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65 BSC

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

0.75

0.60

0.45

COPLANARITY

0.10

SEATING

PLANE

Figure 55. 14-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-14)

Dimensions shown in millimeters

A

B

C

D

E

0.650

0.595

0.540

1.50

1.46

1.42

3.00

2.96

2.92

1

2

3

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

0.340

0.320

0.300

2.00

BSC

BALL 1

IDENTIFIER

SEATING

PLANE

1.00

BSC

0.50

BSC

0.50 BSC

0.25

BSC

0.25

BSC

0.25

BSC

0.25

BSC

0.50 BSC

0.50 BSC

0.380

0.355

0.330

0.270

0.240

0.210

0.10 MAX

COPLANARITY

Figure 56. 14-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-14-1)

Dimensions shown in millimeters