ADRF5040

Data Sheet

Rev. A | Page 14 of 14

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-VGGD-8.

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

SEATING

PLANE

0.90

0.85

0.80

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

24

7

12

13

18

19

6

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.30

0.25

0.18

PIN 1

INDICATOR

0.20 MIN

2.85

2.70 SQ

2.55

EXPOSED

PAD

Figure 28. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.85 mm Package Height

(CP-24-16)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package

Option

ADRF5040BCPZ

−40°C to +85°C

MSL3

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-16

XXXXX

#

5040

ADRF

ADRF5040BCPZ-R7

−40°C to +85°C

MSL3

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-16

XXXXX

#

5040

ADRF

ADRF5040-EVALZ

Evaluation Board

1

These models are RoHS Compliant Parts.

2

See the Absolute Maximum Ratings section.

3

XXXXX is the 5-digit lot number.

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D14290-0-2/17(A)