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MPC860DP 数据表(PDF) 73 Page - Motorola, Inc |
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MPC860DP 数据表(HTML) 73 Page - Motorola, Inc |
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73 / 76 page ![]() MOTOROLA MPC860 Family Hardware Specifications 73 Mechanical Dimensions of the PBGA Package 14.2 Mechanical Dimensions of the PBGA Package For more information on the printed circuit board layout of the PBGA package, including thermal via design and suggested pad layout, please refer to Motorola Application Note, Plastic Ball Grid Array (order number: AN1231/D), available from your local Motorola sales office. Figure 14-75 shows the mechanical dimensions of the PBGA package. Figure 14-75. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SIDE VIEW BOTTOM VIEW 18X 4X 357X b TOP VIEW A2 A3 e 0.3 M C D A A1 D2 0.15 M C E E2 0.2 C A B 0.2 D1 E1 AB 0.25 C 0.35 C C NOTES: 1. Dimensions and tolerancing per ASME Y14.5M, 1994. 2. Dimensions in millimeters. 3. Dimension b is the maximum solder ball diameter measured parallel to datum C. DIM MIN MAX MILLIMETERS A --- 2.05 0.50 0.70 A2 0.95 1.35 A3 0.70 0.90 b 0.60 0.90 D 25.00 BSC D1 22.86 BSC D2 22.40 22.60 e 1.27 BSC E 25.00 BSC E1 22.86 BSC E2 22.40 22.60 A1 Case No. 1103-01 |
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