STM32F411CC datasheet(9/149 Pages) STMICROELECTRONICS

9 / 149 page

DocID026289 Rev 6

9/149

STM32F411xC STM32F411xE

List of figures

chip scale package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

Figure 47.

WLCSP49 - 49-ball, 2.999 x 3.185 mm, 0.4 mm pitch wafer level chip scale

recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

Figure 48.

WLCSP49 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Figure 49.

UFQFPN48 - 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch

quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Figure 50.

UFQFPN48 - 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch

quad flat recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

Figure 51.

UFQFPN48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

Figure 52.

LQFP64 - 64-pin, 10 x 10 mm, 64-pin low-profile quad flat package outline . . . . . . . . . . 130

Figure 53.

LQFP64 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Figure 54.

LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Figure 55.

LQFP100 - 100-pin, 14 x 14 mm, 100-pin low-profile quad flat

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

Figure 56.

LQFP100 - 100-pin, 14 x 14 mm, 100-pin low-profile quad flat

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Figure 57.

LQPF100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Figure 58.

UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch

ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Figure 59.

Recommended PCB design rules for pads (0.5 mm-pitch BGA) . . . . . . . . . . . . . . . . . . . 138

Figure 60.

UFBGA100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

Figure 61.

USB controller configured as peripheral-only and used in Full-Speed mode . . . . . . . . . . 143

Figure 62.

USB controller configured as host-only and used in Full-Speed mode. . . . . . . . . . . . . . . 143

Figure 63.

USB controller configured in dual mode and used in Full-Speed mode . . . . . . . . . . . . . . 144

Figure 64.

Sensor Hub application example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

Figure 65.

Batch Acquisition Mode (BAM) example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

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