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STM32F411CC 数据表(PDF) 125 Page - STMicroelectronics |
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STM32F411CC 数据表(HTML) 125 Page - STMicroelectronics |
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125 / 149 page  DocID026289 Rev 6 125/149 STM32F411xC STM32F411xE Package information 141 Figure 47. WLCSP49 - 49-ball, 2.999 x 3.185 mm, 0.4 mm pitch wafer level chip scale recommended footprint Table 79. WLCSP49 - 49-ball, 2.999 x 3.185 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.380 - - 0.0150 - A3(2) 2. Back side coating - 0.025 - - 0.0010 - b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 2.964 2.999 3.034 0.1167 0.1181 0.1194 E 3.150 3.185 3.220 0.1240 0.1254 0.1268 e - 0.400 - - 0.0157 - e1 - 2.400 - - 0.0945 - e2 - 2.400 - - 0.0945 - F - 0.2995 - - 0.0118 - G - 0.3925 - - 0.0155 - aaa - 0.100 - - 0.0039 - bbb - 0.100 - - 0.0039 - ccc - 0.100 - - 0.0039 - ddd - 0.050 - - 0.0020 - eee - 0.050 - - 0.0020 - |
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